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Molybdenum Round

Attribute：
Mode of production:
There are three main ways to produce round molybdenum wafer :

(1) molybdenum rod wire cutting. The wire-cut production method of molybdenum rod has less geometric loss and higher yield, but the wire-cut efficiency is low. Meanwhile, the grain size of the edge and center of the round surface is easy to be uneven after being rounded, which is still in the experimental research stage.

(2) Direct pressing and sintering of molybdenum powder. Molybdenum powder pressing and sintering method yield is higher than (1), but the density is low, the strength is poor, the grain structure is disordered arrangement, users found in use when it is laminated with silicon wafer is easy to crack or fracture, still need to be improved;

(3) molybdenum plate punching.

Overview
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Parameter：

Process	rolling, vacuum annealing
Surface	polished surface, cold rolled surface, alkali wash surface
Characteristics	High temperature and corrosion resistance
Characteristics	High temperature and corrosion resistance
Molybdenum content	99.95%
Specifications	Customizable

Product Features

Molybdenum disc is a circular refractory metal component fabricated from high-purity molybdenum blanks through forging, rolling, precision cutting and surface finishing. It serves as a key consumable in vacuum heat treatment, semiconductor coating, electronic manufacturing, rare earth smelting and high-temperature sintering industries, boasting a comprehensive set of outstanding physical and chemical properties.

First of all, it boasts extraordinary high-temperature resistance. The melting point of molybdenum hits 2620°C, so the disc can retain stable mechanical strength and complete flatness under long-term ultra-high temperature service. It has great resistance to high-temperature creep and will not bend, sag or crack under repeated heating and cooling cycles. With an extremely low thermal expansion coefficient, its overall dimension stays nearly unchanged amid drastic temperature swings, guaranteeing stable machining accuracy for precision equipment.

In terms of thermal and electrical performance, the molybdenum disc delivers balanced and uniform thermal conductivity, enabling even heat distribution when used as heat-bearing plates in vacuum furnaces. Its steady electrical conductivity makes it perfect for electrode substrates and conductive carrier discs. Moreover, it generates negligible vapor pressure in vacuum environments, releasing no volatile impurities that may contaminate furnace chambers or semiconductor wafers, fully satisfying strict cleanliness standards of thin-film sputtering processes.

Chemically, the disc shows reliable corrosion resistance against most dilute acids, alkalis and molten non-ferrous metals at room and medium temperatures. Oxidation barely occurs under vacuum or inert gas protection; mild surface oxidation only emerges when the temperature rises above 400°C in open air. It stays inert to molten glass, ceramics and rare earth melts, preventing cross-contamination during sintering and melting production.

Applications
Molybdenum wafer chemical composition is stable, molybdenum content up to 99.9%, accurate size, low surface roughness, can reach Ra 1.6pum below; High melting point, good electrical and thermal conductivity, high strength, linear expansion coefficient and silicon close, good processing performance, is the silicon rectifier complete sets of equipment, semiconductor silicon devices, vacuum tube anode, instrument production indispensable substrate material.